{"meta":{"title":"Global Semiconductor Supply-Chain Universe","researchDate":"2026-08-20 Asia/Seoul","generatedFrom":"DR-1 taxonomy baseline + DR-2 census + DR-3 adversarial audit","status":"PARTIAL","taxonomyBaseline":{"totalNodes":875,"leafNodes":790,"supplySideLeafNodes":406},"renderedNodeCount":322,"renderedEdgeCount":611,"warning":"The atlas renders the audited final topology and verified/partial company anchors. It is not a claim that every one of the 790 leaf nodes has complete supplier, customer, market-share, and qualification evidence."},"marketBaseline":[{"metric":"Semiconductor equipment billings","period":"2025","status":"Actual","value":"$135B","definition":"SEMI total semiconductor manufacturing equipment billings"},{"metric":"Total semiconductor manufacturing equipment","period":"2026","status":"Forecast (Jul-2026)","value":"$165.9B","definition":"SEMI equipment forecast; not identical to fab spending"},{"metric":"Wafer fab equipment","period":"2026","status":"Forecast","value":"$143.9B","definition":"WFE segment"},{"metric":"Test equipment","period":"2026","status":"Forecast","value":"$15.3B","definition":"Semiconductor test equipment"},{"metric":"Assembly / packaging equipment","period":"2026","status":"Forecast","value":"$6.7B","definition":"Assembly and packaging equipment"},{"metric":"Semiconductor materials","period":"2025","status":"Actual","value":"$73.2B","definition":"Wafer-fab + packaging materials"},{"metric":"Wafer-fab materials","period":"2025","status":"Actual","value":"$45.8B","definition":"SEMI wafer-fab materials"},{"metric":"Packaging materials","period":"2025","status":"Actual","value":"$27.4B","definition":"SEMI packaging materials"},{"metric":"Semiconductor device market","period":"2026","status":"Forecast","value":"$1.51T","definition":"WSTS device sales; never add to equipment/material TAM"}],"sources":[{"id":"SEMI-EQUIPMENT","title":"SEMI Equipment Market Data","url":"https://www.semi.org/en/products-services/market-data/equipment","type":"Primary / industry association"},{"id":"SEMI-MATERIALS-2025","title":"Global Semiconductor Materials Market Revenue Reaches $73.2B in 2025","url":"https://www.semi.org/en/semi-press-release/global-semiconductor-materials-market-revenue-reaches-record-73.2-billion-dollars-in-2025-semi-reports","type":"Primary / industry association"},{"id":"SEMI-SCIS","title":"SEMI Components & Systems (SCIS)","url":"https://www.semi.org/en/communities/scis","type":"Primary / industry association"},{"id":"SEMICON-KOREA","title":"SEMICON Korea Exhibitor Categories","url":"https://www.semiconkorea.org/en/about/exhibitor-list","type":"Primary / exhibition taxonomy"},{"id":"WSTS-2026","title":"WSTS 2026 Semiconductor Market Forecast","url":"https://www.wsts.org/76/103/Global-Semiconductor-Market-Surges-Beyond-15T-2026","type":"Primary / market statistics"},{"id":"ASML-HIGH-NA","title":"ASML High-NA EUV readiness milestone","url":"https://www.asml.com/en/news/press-releases/2026/high-na-euv-reaches-new-readiness-milestone","type":"Primary / company"},{"id":"INTEL-18A","title":"Intel 18A Process Technology","url":"https://www.intel.com/content/www/us/en/foundry/process/18a.html","type":"Primary / company"},{"id":"SKHYNIX-HBM4","title":"SK hynix HBM4 mass-production readiness","url":"https://news.skhynix.com/en/sk-hynix-completes-worlds-first-hbm4-development-and-readies-mass-production/","type":"Primary / company"},{"id":"MICRON-HBM4","title":"Micron HBM4 high-volume production","url":"https://investors.micron.com/news/press-release/2026/Micron-in-High-Volume-Production-of-HBM4-Designed-for-NVIDIA-Vera-Rubin-PCIe-Gen6-SSD-and-SOCAMM2-03-16-2026/default.aspx","type":"Primary / company"},{"id":"BIS-CHINA-FABS","title":"BIS closes export-control loophole for foreign-owned fabs in China","url":"https://www.bis.gov/press-release/department-commerce-closes-export-controls-loophole-foreign-owned-semiconductor-fabs-china","type":"Primary / government"},{"id":"MOTIE-SOBUJANG","title":"MOTIE 소재·부품·장비 핵심전략기술 자료","url":"https://www.motie.go.kr/attach/down/aa4abe331409819421ff269b271f06a6/f9c79804b4c01395fa53b620d51bb242/778bdbf5db9ced7c8fd52756c00bf0cd","type":"Primary / government"}],"groups":["AUTO","COMPANY","DEM","DESIGN","EQCOMP","FAB","FE","GEO","HBM","MASK","MAT","PC","PKG","PROD","SEM","SERVICE","TEST","WAF"],"kinds":["buyer","component","demand","ecosystem","geography","hbm","infrastructure","inspection","material","packaging","process","product","service","software","supplier","test"],"statuses":["PARTIAL","VERIFIED"],"evidences":["A","B","C","D"],"coverages":["COMPLETE","PARTIAL"],"regions":["France","Germany","Global","Japan","Japan / United States","Korea","Korea / United States","Netherlands","Taiwan","United States"],"customerStatuses":["OFFICIAL / NODE-SPECIFIC","UNVERIFIED"],"relations":["FCBGA HVM","HBM4 HVM","HBM4 agreement","High-NA HVM","buys/uses","co-development","consumes","controlled-by","demand","enables","integrates","located-in","long-term gas supply","maintains","process","requires","sub-fab","supplies","taxonomy"],"nodeFiles":["compact-nodes-1-small.json","compact-nodes-2-small.json","compact-nodes-3-small.json","compact-nodes-4-small.json"],"edgeFiles":["compact-edges-1.json","compact-edges-2.json"]}